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Developments in universal chiplet interconnect express could be used to construct three-dimensional system-on-chip design architectures that offer power, performance and reliability characteristics approaching or exceeding those of current monolithic system-on-chip designs as the bump interconnect pitch approaches 1 µm.
An approach to dynamically control the photoresponsivity of pixels in a computational sensor based on local image gradients enables the precise and robust detection of edge features of targets in dim light conditions from a single image capture.
Tapes whose adhesive force is controlled by ultraviolet illumination can be used to cleanly transfer large-area graphene, molybdenum disulfide and other two-dimensional materials with a low thermal budget and using no organic solvents.
Large-area two-dimensional materials can be transferred at low temperatures and without solvents using conformable tapes whose adhesive force varies with ultraviolet illumination, allowing transfer to various planar and non-planar substrates.
This Review explores the development of ingestible electronics and provides a step-by-step guide for the design of ingestible electronic capsules at the system level.
The correlated optoelectronic characteristics of multi-terminal mixed-dimensional graphene–germanium heterostructure devices can be used for the accurate detection and robust tracking of dim targets.
Polycrystalline thin films of elemental bismuth exhibit a room-temperature nonlinear transverse voltage due to geometric effects of surface electrons that is tunable and can be extended to efficient high-harmonic generation at terahertz frequencies.
An electronic skin that is capable of long-term monitoring of vital signs and molecular biomarkers in sweat can—with the help of machine learning—be used to classify stress responses with high accuracy and predict state anxiety levels with high reliability.
By transferring laser-induced graphene to a hydrogel film at cryogenic temperatures, stretchable graphene–hydrogel interfaces can be created for application in wearable and implantable electronics.
A biomimetic olfactory system that integrates nanotube sensor arrays with up to 10,000 individually addressable sensors per chip can offer high sensitivity to various gases with excellent distinguishability for mixed gases and 24 distinct odours.
An inverter that uses a self-biased molybdenum disulfide homojunction as the load and n-type transistor as the driver can exhibit lower static power than complementary metal–oxide–semiconductor (CMOS) or pseudo-n-type metal–oxide–semiconductor (NMOS) architectures.
An approach to soft electronics that is inspired by the emergence process of butterflies can be used to create devices that can recover from crumpling.
The planar structure of thin-film piezoelectric resonators limits the integration of multiband processors on a single chip. A three-dimensional nanomechanical resonator based on conformal ferroelectric gates to excite resonance in scalable silicon fins is shown to enable multiband integration on a single chip and to facilitate densification of processors for ultrawide-band wireless communication.
An acoustic resonator that uses a three-dimensional silicon fin and an atomic-layered hafnia-zirconia ferroelectric transducer can be integrated into chip-scale filter arrays to make adaptive switch-free spectral processors for wireless communication.
This Review examines the development of neuromorphic hardware systems based on halide perovskites, considering how devices based on these materials can serve as synapses and neurons, and can be used in neuromorphic computing networks.