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Volume 7 Issue 2, February 2024

3D resonators for spectral processors

Spectral processors for wireless communication can be created using acoustic resonators made from 3D silicon nano-fins with hafnia–zirconia ferroelectric gates wrapped around them. The scanning electron microscopy image on the cover shows an array of filters created by electrically coupling 3D resonators with different frequencies, with the different devices highlighted by different false colours.

See Hakim et al.

Image: Faysal Hakim, University of Florida. Cover design: Lauren Heslop.

Editorial

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News & Views

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Research Briefings

  • The planar structure of thin-film piezoelectric resonators limits the integration of multiband processors on a single chip. A three-dimensional nanomechanical resonator based on conformal ferroelectric gates to excite resonance in scalable silicon fins is shown to enable multiband integration on a single chip and to facilitate densification of processors for ultrawide-band wireless communication.

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  • This Review explores the development of ingestible electronics and provides a step-by-step guide for the design of ingestible electronic capsules at the system level.

    • Angsagan Abdigazy
    • Mohammed Arfan
    • Yasser Khan
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