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Micropatterning of organic semiconductors by electron-beam exposure can be used to create vertical organic electrochemical transistor arrays and complementary logic circuits with densities of up to 7.2 million transistors per cm2.
Developments in universal chiplet interconnect express could be used to construct three-dimensional system-on-chip design architectures that offer power, performance and reliability characteristics approaching or exceeding those of current monolithic system-on-chip designs as the bump interconnect pitch approaches 1 µm.
Large-area two-dimensional materials can be transferred at low temperatures and without solvents using conformable tapes whose adhesive force varies with ultraviolet illumination, allowing transfer to various planar and non-planar substrates.
The correlated optoelectronic characteristics of multi-terminal mixed-dimensional graphene–germanium heterostructure devices can be used for the accurate detection and robust tracking of dim targets.
Polycrystalline thin films of elemental bismuth exhibit a room-temperature nonlinear transverse voltage due to geometric effects of surface electrons that is tunable and can be extended to efficient high-harmonic generation at terahertz frequencies.
An electronic skin that is capable of long-term monitoring of vital signs and molecular biomarkers in sweat can—with the help of machine learning—be used to classify stress responses with high accuracy and predict state anxiety levels with high reliability.
A biomimetic olfactory system that integrates nanotube sensor arrays with up to 10,000 individually addressable sensors per chip can offer high sensitivity to various gases with excellent distinguishability for mixed gases and 24 distinct odours.
An inverter that uses a self-biased molybdenum disulfide homojunction as the load and n-type transistor as the driver can exhibit lower static power than complementary metal–oxide–semiconductor (CMOS) or pseudo-n-type metal–oxide–semiconductor (NMOS) architectures.
An acoustic resonator that uses a three-dimensional silicon fin and an atomic-layered hafnia-zirconia ferroelectric transducer can be integrated into chip-scale filter arrays to make adaptive switch-free spectral processors for wireless communication.