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A wireless, low-power optoelectronic platform, which is based on micro-LEDs, can provide multimodal programmable control over optogenetic stimulation parameters.
This Review Article examines the development of terahertz integrated electronic and hybrid electronic–photonic systems, considering, in particular, advances that deliver important functionalities for applications in communication, sensing and imaging.
Integrating magnetoresistive random access memory with advanced fin field-effect transistor technology provides a route towards energy-efficient computing.
This Review Article examines state-of-the-art metrology methods for integrated circuits and highlights how new integrated circuit device design and industry requirements affect lithography options and consequently metrology requirements.
Through some unconventional approaches to improving transistor density and performance, the latest logic technology from Intel delivers 100 million transistors per square millimetre — and in the process, reaffirms Moore’s law.
A scanning light probe can locally dope two-dimensional molybdenum ditelluride, allowing monolithically integrated circuits (ICs) to be quickly written on the material.
Scalable electronic synapses fabricated using multilayer hexagonal boron nitride sheets can emulate both long- and short-term plasticity, with an ultralow standby power consumption of 1 fW.
A theoretical analysis of the dynamics of magnetic skyrmions and antiskyrmions shows that large current-induced spin–orbit torques can lead to nonlinear trochoidal motion, which results in a sharp drop in translational velocity.
A multifunctional stretchable electronic system, which can be used to monitor vital signs and build human–machine interfaces, can be created through the vertical stacking of highly integrated layers of soft electronics.
A memory cell design based on two memristors and one minimum-sized transistor can nullify parasitic currents, device-to-device variations and cycle-to-cycle variations in memristive crossbar arrays.
This Perspective argues that electronics is poised to enter a new era of scaling – hyper-scaling – driven by advances in beyond-Boltzmann transistors, embedded non-volatile memories, monolithic three-dimensional integration, and heterogeneous integration techniques.