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Volume 4 Issue 8, August 2021

3D printed thermoelectrics power up

Particle-based thermoelectric inks can be written into complex three-dimensional thermoelectric architectures using a 3D printing process, creating devices that could generate power from minimal heat flow or act as coolers in integrated systems. The computer-generated image on the cover illustrates the direct ink writing of a microscale thermoelectric device on an integrated circuit.

See Kim et al.

Image: Younghee Lee, CUBE3D Graphic. Cover Design: Allen Beattie.

Editorial

  • Flexible devices based on organic semiconductors could be of use in the development of wearable electronics and the Internet of Things, but face competition from other established and emerging technologies.

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Research Highlights

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News & Views

  • Vertical organic thin-film transistors can be used to create complementary circuits that operate at high frequencies.

    • Wei Huang
    • Antonio Facchetti
    News & Views
  • A flexible microprocessor with more than 18,000 NAND gates can be manufactured using metal-oxide thin-film transistor technology.

    • Zili Yu
    News & Views
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Reviews

  • This Review examines the use of colloidal quantum dots in the development of next-generation electronics, including luminescent, optoelectronic, memory and thermoelectric devices.

    • Mengxia Liu
    • Nuri Yazdani
    • Edward H. Sargent
    Review Article
  • This Review examines the development of emerging semiconductor materials—organic semiconductors, colloidal quantum dots and metal halide perovskites—for light-emitting diodes, considering efforts to improve modulation performance and device efficiency, as well as potential applications in on-chip interconnects and light fidelity (Li-Fi).

    • Aobo Ren
    • Hao Wang
    • Ian H. White
    Review Article
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Research

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Amendments & Corrections

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