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Volume 1 Issue 8, August 2018

A 3D twist on stretchable electronics

By stacking, and electrically connecting, layers of stretchable circuits, three-dimensional integrated devices can be built that are capable of wirelessly monitoring a person’s vital signs and creating human–machine interfaces. The cover shows an optical microscopy image of a four-layer stretchable device that is equipped with Bluetooth data communication capabilities and can simultaneously sense electrophysiological signals, strain, temperature, acceleration, and orientation.

See Huang et al. and News & Views by Kim et al.

Image: Sheng Xu, University of California San Diego. Cover Design: Allen Beattie.

Volume 1 Issue 8

Editorial

  • This year’s International Physics Olympiad — ably assisted by over 1,000 paper transistors — could help inspire the next generation of scientists, engineers and technicians.

    Editorial

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Research Highlights

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News & Views

  • A theoretical analysis of the dynamics of magnetic skyrmions and antiskyrmions shows that large current-induced spin–orbit torques can lead to nonlinear trochoidal motion, which results in a sharp drop in translational velocity.

    • Seonghoon Woo
    News & Views
  • Scalable electronic synapses fabricated using multilayer hexagonal boron nitride sheets can emulate both long- and short-term plasticity, with an ultralow standby power consumption of 1 fW.

    • Muhammad M. Hussain
    • Nazek El-Atab
    News & Views
  • A memory cell design based on two memristors and one minimum-sized transistor can nullify parasitic currents, device-to-device variations and cycle-to-cycle variations in memristive crossbar arrays.

    • Dietmar Fey
    News & Views
  • A multifunctional stretchable electronic system, which can be used to monitor vital signs and build human–machine interfaces, can be created through the vertical stacking of highly integrated layers of soft electronics.

    • Dae-Hyeong Kim
    • Dong Chan Kim
    News & Views
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Reviews

  • This Perspective argues that electronics is poised to enter a new era of scaling – hyper-scaling – driven by advances in beyond-Boltzmann transistors, embedded non-volatile memories, monolithic three-dimensional integration, and heterogeneous integration techniques.

    • Sayeef Salahuddin
    • Kai Ni
    • Suman Datta
    Perspective
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Research

  • Device-to-device and cycle-to-cycle variations and leakage in memristor crossbar arrays can be alleviated with a memory cell design that uses the ratio of the resistances of two memristors to encode information, rather than the absolute resistance of a single memristor.

    • Miguel Angel Lastras-Montaño
    • Kwang-Ting Cheng
    Article
  • By combining strategies in material design and advanced microfabrication, three-dimensional integrated stretchable electronic devices can be created, including an eight-channel sensing system with Bluetooth communication capabilities that can be used to extract an array of signals from the human body.

    • Zhenlong Huang
    • Yifei Hao
    • Sheng Xu
    Article
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Reverse Engineering

  • The discovery of the twisted nematic effect allowed liquid crystal displays to become a practical and ubiquitous technology. Martin Schadt recounts how it came about.

    • Martin Schadt
    Reverse Engineering
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