The planar structure of thin-film piezoelectric resonators limits the integration of multiband processors on a single chip. A three-dimensional nanomechanical resonator based on conformal ferroelectric gates to excite resonance in scalable silicon fins is shown to enable multiband integration on a single chip and to facilitate densification of processors for ultrawide-band wireless communication.
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This is a summary of: Hakim, F. et al. A ferroelectric-gate fin microwave acoustic spectral processor. Nat. Electron. https://doi.org/10.1038/s41928-023-01109-5 (2024).
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Three-dimensional acoustic resonators for massively scalable spectral processors. Nat Electron 7, 100–101 (2024). https://doi.org/10.1038/s41928-023-01110-y
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DOI: https://doi.org/10.1038/s41928-023-01110-y
