Abstract
Photodetectors that are sensitive in the shortwave-infrared (SWIR) range (1–2 µm) are of great interest for applications such as machine vision, autonomous driving and three-dimensional, night and adverse weather imaging, among others. Currently available technologies in the SWIR range rely on costly epitaxial semiconductors that are not monolithically integrated with complementary metal–oxide–semiconductor electronics. Solution-processed quantum dots can address this challenge by enabling low-cost manufacturing and simple monolithic integration on silicon in a back-end-of-line process. So far, colloidal quantum dot materials to access the SWIR regime are mostly based on lead sulfide and mercury telluride compounds, imposing major regulatory concerns for their deployment in consumer electronics due to the presence of toxic heavy metals. Here we report a new synthesis method for environmentally friendly silver telluride quantum dots and their application in high-performance SWIR photodetectors. The colloidal quantum dot photodetector stack employs materials compliant with the Restriction of Hazardous Substances directives and is sensitive in the spectral range from 350 nm to 1,600 nm. The room-temperature detectivity is of the order of 1012 Jones, the 3 dB bandwidth is in excess of 0.1 MHz and the linear dynamic range is over 118 dB. We also realize a monolithically integrated SWIR imager based on solution-processed, toxic-heavy-metal-free materials, thus paving the way for this technology to the consumer electronics market.
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Acknowledgements
G.K. acknowledges financial support from the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation programme (grant agreement no. 101002306), the Fundació Joan Ribas Araquistain (FJRA), the Fundació Privada Cellex, the program CERCA and ‘Severo Ochoa’ Centre of Excellence CEX2019-000910-S funded by the Spanish State Research Agency. Y.W. acknowledges support from the European Union’s Horizon 2020 research and innovation programme under the Marie Skłodowska-Curie grant agreement no. 754558. L.P. acknowledges support from the Horizon Europe Framework Programme, the Marie Skłodowska-Curie Postdoctoral Fellowships (grant agreement no. 101052595). S.G. acknowledges support from the Horizon—EIC action under the grant agreement no. 101113088—QSTACK. We would like to thank Y. Ren and D. Mandal for their help during the metal electrodes deposition and T. Khodkov for supplying the diced chips for the imager.
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G.K. supervised and directed the study. Y.W. and G.K. conceived the idea, designed this study and co-wrote the manuscript, with feedback from the co-authors. Y.W. synthesized the materials, performed the material characterization, fabricated and characterized the devices and analysed the data. L.P. contributed to the development and synthesis of the material. Y.W. fabricated the image sensor with the help of A.B. and Y.B. Y.B. contributed to the design of the experiment for the integration of the QD film onto the ROIC. J.S. performed the characterization of the image sensor and took the images. Y.W. and J.S. conducted the performance analysis of the imagers. A.M. contributed to the device fabrication. S.G. contributed in the supervision and design of experiments for the image sensor demonstration.
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G.K. and Y.W. have filed European patent applications nos. 23382511 and 23382714. G.K. serves as a co-founder, shareholder and scientific advisor at Qurv. J.S. and A.B. are employees of Qurv. S.G. is a shareholder and employee of Qurv. The other authors declare no competing interests.
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Supplementary Notes 1–5, Figs. 1–27 and references.
Source data
Source Data Fig. 1
Absorption spectra and size distribution data.
Source Data Fig. 2
J–V curves, EQE and responsivity.
Source Data Fig. 3
LDR, frequency-dependent response, transient current curve and detectivity.
Source Data Fig. 4
Dark and light J–V curves and EQE.
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Wang, Y., Peng, L., Schreier, J. et al. Silver telluride colloidal quantum dot infrared photodetectors and image sensors. Nat. Photon. 18, 236–242 (2024). https://doi.org/10.1038/s41566-023-01345-3
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DOI: https://doi.org/10.1038/s41566-023-01345-3