Abstract
Insulating layers based on oxides and nitrides provide high capacitance, low leakage, high breakdown field and resistance to electrical stresses when used in electronic devices based on rigid substrates. However, their typically high process temperatures and brittleness make it difficult to achieve similar performance in flexible or organic electronics. Here, we show that poly(1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane) (pV3D3) prepared via a one-step, solvent-free technique called initiated chemical vapour deposition (iCVD) is a versatile polymeric insulating layer that meets a wide range of requirements for next-generation electronic devices. Highly uniform and pure ultrathin films of pV3D3 with excellent insulating properties, a large energy gap (>8 eV), tunnelling-limited leakage characteristics and resistance to a tensile strain of up to 4% are demonstrated. The low process temperature, surface-growth character, and solvent-free nature of the iCVD process enable pV3D3 to be grown conformally on plastic substrates to yield flexible field-effect transistors as well as on a variety of channel layers, including organics, oxides, and graphene.
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Acknowledgements
This work was supported in part by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and Future Planning (MSIP) (Grant Nos 2011-0010730 (S.G.I.), 2013-065553 (B.J.C.), NRF-2014R1A2A1A11052860 (S.Y.)), and by a grant from the Center for Advanced Soft Electronics funded by MSIP as Global Frontier Project (Grant Nos CASE-2011-0031638 (B.J.C.), CASE-2014M3A6A5060948 (S.Y.), CASE-2013M3A6A5073183 (Y-Y.N.)). We are grateful to S-Y. Choi at KAIST for allowing us to use a cryogenic vacuum probe station for temperature-dependent measurement of insulator characteristics and to M. C. Barr at Ubiquitous Energy for valuable comments. We also appreciate C. S. Hwang at Electronics and Telecommunications Research Institute (ETRI) for the deposition of IGZO layers.
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S.G.I., S.Y., H.M. and H.S. designed the experiments on the use of iCVD-based polymers for insulators of organic and oxide electronic devices and analysed the associated experimental results. H.M. and H.S. carried out fabrication and characterization of films and devices made thereof. M.K. and S.L. also carried out the related experiments and characterization. W.C.S., H.S., J.H.B., S.G.I. and B.J.C. designed the work on graphene FETs and interpreted experimental results. W.C.S., H.S. and J.H.B. carried out the associated experiments. Y-Y.N. and W-T.P. designed the work on solution-processed OFET arrays and interpreted the related experimental results. H.M., H.S., W.C.S., B.J.C., S.Y. and S.G.I. wrote the manuscript. All authors read and commented on the manuscript. H.M., H.S. and W.C.S. contributed equally to this work. B.J.C., S.Y. and S.G.I. contributed equally as corresponding authors.
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Moon, H., Seong, H., Shin, W. et al. Synthesis of ultrathin polymer insulating layers by initiated chemical vapour deposition for low-power soft electronics. Nature Mater 14, 628–635 (2015). https://doi.org/10.1038/nmat4237
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DOI: https://doi.org/10.1038/nmat4237
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