Abstract
Pristine van der Waals (vdW) heterostructures formed between two-dimensional (2D) and other materials can be used to create optical and electronic devices. However, the weak vdW forces alone do not allow direct physical stacking of arbitrary layers. As a result, vdW heterostructure fabrication typically requires solvents, sacrificial layers or high temperatures, which can introduce damage and contaminants. Here, we show that adhesive matrix transfer can eliminate these limitations and can provide vdW integration beyond the limits of vdW forces. In the approach, a hybrid high- and low-adhesion surface is used to decouple the forces driving the transfer from the vdW forces defining the heterostructure of interest. We show that the technique can be used to achieve direct vdW integration of diverse 2D materials (MoS2, WSe2, PtS2 and GaS) with dielectrics (SiO2 and Al2O3), which is conventionally forbidden but critical for active devices and scalable, aligned heterostructure formation. The approach also allows single-step 2D material-to-device integration, which we illustrate by fabricating arrays of monolayer MoS2 transistors. As any exposure to solvents or polymers is avoided, the interfaces and surfaces remain pristine. Thus, intrinsic 2D material properties can be probed without the influence of processing steps. The materials can be further engineered through surface treatments and used to fabricate unconventional device form factors.
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Data availability
The data that support the plots within this paper and other findings of this study are available from the corresponding authors on reasonable request.
Code availability
The source code for processing the data is available from the corresponding author upon request.
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Acknowledgements
This work was supported by the National Science Foundation (NSF; Award No. CMMI-2135846) and the NSF Center for Energy Efficient Electronics Science (Award No. ECCS-0939514). P.F.S., P.J.-P. and S.O.S. acknowledge support from the NSF Graduate Research Fellowship Program (Grant No. 1745302). The work by H.G. and X.L. was supported by the US Department of Energy, Office of Science, Basic Energy Sciences (Award No. DE-SC0021064). The work by X.L., Q.T. and H.K. was supported by the NSF (Award No. CHE-1945364). H.G. acknowledges support from a BUnano Cross-Disciplinary Fellowship at Boston University. A.-Y.L. and J.K. acknowledge support from the US Army Research Office through the Institute for Soldier Nanotechnologies at the Massachusetts Institute of Technology (MIT; Cooperative Agreement No. W911NF-18-2-0048). The fabrication and characterization procedures in this work were in part carried out using the MIT.nano shared facilities. We thank the research staff of MIT.nano, in particular K. Broderick, W. Hess, J. Scholvin, D. Terry and D. Ward, for their support of this work. P.F.S. would further like to thank J. Zhu for electrical measurement advice, N. Romeo for help with mechanical modelling and M. Saravanapavanantham for characterization support. The TEM sample preparation and imaging were performed at the Harvard University Center for Nanoscale Systems with the help of S. Kraemer and J. Gardener. The Center for Nanoscale Systems is a member of the National Nanotechnology Coordinated Infrastructure Network, which is supported by the NSF (ECCS Award No. 1541959).
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P.F.S. and F.N. conceived the project, designed the experiments and wrote the manuscript. P.F.S. performed the experiments and analysed the results. P.F.S., P.-J.P., W.Z. and F.N. developed the template-stripping process. W.Z. assisted with the photoluminescence measurements. P.F.S., M.T. and F.N. developed the MoS2 transfer process. S.O.S. assisted with TEM sample preparation and imaging. H.G. and X.L. grew the CVD MoS2. S.-Y.T., Y.-L.C., C.-N.K. and C.S.L. grew the PtS2. Q.T. and X.L. grew the GaS. P.F.S., H.K., A.-Y.L., J.K., X.L. and F.N. developed the graphene transfer process. F.N. supervised the project. All authors contributed to finalizing the manuscript.
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Satterthwaite, P.F., Zhu, W., Jastrzebska-Perfect, P. et al. Van der Waals device integration beyond the limits of van der Waals forces using adhesive matrix transfer. Nat Electron 7, 17–28 (2024). https://doi.org/10.1038/s41928-023-01079-8
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DOI: https://doi.org/10.1038/s41928-023-01079-8
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