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INTELLIGENT DEVICES

Lego-like reconfigurable AI chips

Nature Electronics volume 5, pages 327–328 (2022)Cite this article

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A reconfigurable integration technology based on stackable chips with embedded arrays of optoelectronic devices and memristive crossbars could be of use in edge intelligence applications.

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Fig. 1: Stackable hetero-integrated chips with light communication.

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Authors and Affiliations

  1. Institute of Brain-Inspired Intelligence, National Laboratory of Solid State Microstructures, School of Physics, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China

    Shi-Jun Liang & Feng Miao

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  1. Shi-Jun Liang
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  2. Feng Miao
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Correspondence to Feng Miao.

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The authors declare no competing interests.

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Liang, SJ., Miao, F. Lego-like reconfigurable AI chips. Nat Electron 5, 327–328 (2022). https://doi.org/10.1038/s41928-022-00785-z

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