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2D materials

All-2D electronics for AI processing

Nature Materials volume 22, pages 1433–1434 (2023)Cite this article

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The monolithic 3D integration of wafer-free all-2D-materials-based electronics can produce an AI processor.

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Fig. 1: Historical development of integration from lateral integration to vertical integration.

References

  1. Wolf, W., Jerraya, A. A. & Martin, G. IEEE Trans. Comput. Aided Des. Integr. Circ. Syst. 27, 1701–1713 (2008).

    Article  Google Scholar 

  2. Shulaker, M. M. et al. Nature 547, 74–78 (2017).

    Article  CAS  Google Scholar 

  3. Choi, C. et al. Nat. Electron. 5, 386–393 (2022).

    Article  Google Scholar 

  4. Kang, J.-H. et al. Nat. Mater. https://doi.org/10.1038/s41563-023-01704-z (2023).

  5. Lau, J. H. In 2011 Int. Symposium on Advanced Packaging Materials (APM) 462–488 (IEEE, 2011); https://doi.org/10.1109/ISAPM.2011.6105753

  6. Shulaker, M. M. et al. In 2015 Design, Automation & Test in Europe Conference & Exhibition (DATE) 1197–1202 (IEEE, 2015); https://doi.org/10.7873/DATE.2015.1111

  7. Liu, Y., Huang, Y. & Duan, X. Nature 567, 323–333 (2019).

    Article  CAS  Google Scholar 

  8. Geim, A. K. & Grigorieva, I. V. Nature 499, 419–425 (2013).

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China

    Fang Wang & Weida Hu

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  1. Fang Wang
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  2. Weida Hu
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Correspondence to Weida Hu.

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Wang, F., Hu, W. All-2D electronics for AI processing. Nat. Mater. 22, 1433–1434 (2023). https://doi.org/10.1038/s41563-023-01720-z

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