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References
K. El Gersifi, G. Durand, and G. Tersac, Polym. Degrad. Stab., 91, 690 (2006).
J.-P. Yang, Z.-K. Chen, G. Yang, S.-Y. Fu, and L. Ye, Polymer, 49, 3168 (2008).
Q. P. Guo, A. Habrard, Y. Park, P. J. Halley, and G. P. Simon, J. Polym. Set, Part B: Polym. Phys., 44, 889 (2006).
D. Ratna, R. Varley, and G. P. Simon, J. Appl. Polym. Sci., 89, 2339 (2003).
S. He, K. Shi, J. Bai, Z. Zhang, L. Li, Z. Du, and B. Zhang, Polymer, 42, 9641 (2001).
C. A. May, in “Epoxy Resins: Chemistry and Technology,” 2nd ed., Marcel Dekker, New York, 1988.
S.-J. Park, J.-G. Kang, and S.-H. Kwon, J. Polym. Sci., Part B: Polym. Phys., 42, 3841 (2004).
A. Omrani, L. C. Simon, A. A. Rostami, and M. Ghaemy, Eur. Polym. J., 44, 769 (2008).
F. X. Perrin, T. M. H. Nguyen, and J. L. Vernet, Eur. Polym. J., 43, 5107 (2007).
F. F. Wong, K.-L. Chen, C. M. Lin, and M.-Y. Yeh, J. Appl. Polym. Sci., 104, 3292 (2007).
N. Galego and F. González, Polym. Int., 40, 213 (1996).
S.-J. Park, F.-L. Jin, J.-R. Lee, and J.-S. Shin, Eur. Polym. J., 41, 231 (2005).
S.-J. Park, M.-K. Seo, and J.-R. Lee, J. Polym. Sci., Part B: Polym. Phys., 42, 2419 (2004).
J. K. Lee, Y. Choi, J.-R. Lee, and J. Park, Macromol. Res., 10, 34 (2002).
Y. C. Kim, S.-J. Park, and J.-R. Lee, Polym. J., 29, 759 (1997).
S. Nakano and T. Endo, J. Polym. Sci., Part A: Polym. Chem., 34, 475 (1996).
Y. YaĞci and A. Önen, J. Polym. Sci., Part A: Polym. Chem., 34, 3621 (1996).
S.-B. Lee, T. Takata, and T. Endo, Macromolecules, 23, 431 (1990).
H. Uno, T. Takata, and T. Endo, Macromolecules, 22, 2502 (1989).
J. A. Mcgowen and L. J. Mathias, Polym. Compos., 18, 348 (1997).
B. X. Fu, M. Namani, and A. Lee, Polymer, 44, 7739 (2003).
M. Ito, H. Hata, and K. Kamagata, J. Appl. Polym. Sci., 33, 1843 (1987).
R. T. Shuman, P. L. Ornstein, J. W. Paschal, and P. D. Gesellchen, J. Org. Chem., 55, 738 (1990).
J. K. Bashkin, Curr. Opin. Chem. Biol., 3, 752 (1999).
M. Harfenist, J. Am. Chem. Soc., 76, 4991 (1954).
K. Rorig, J. D. Johnston, R. W. Hamilton, and T. J. Telinski, Org. Synth., 4, 576 (1963).
O. Hromatka, R. Klink, and F. Sauter, Monatsh. Chem., 93, 1294 (1962).
Y.-C. Chen and W.-Y. Chiu, Polymer, 42, 5439 (2001).
J. M. Barton, G. J. Buist, I. Hamerton, B. J. Howlin, J. R. Jones, and S. Liu, J. Mater. Chem., 4, 379 (1994).
T. J. Dearlove, J. Appl. Polym. Sci., 14, 1615 (1970).
J. Berger and F. Lohse, J. Appl. Polym. Sci., 30, 531 (1985).
S. K. Ooi, W. D. Cook, G. P. Simon, and C. H. Such, Polymer, 41, 3639 (2000).
M. S. Heise and G. C. Martin, J. Appl. Polym. Sci., 39, 721 (1990).
D. R. Lide, in “CRC Handbook of Chemistry and Physics,” 84th ed., 2003, p 8.
S. Wang and C. P. Wong, “Advanced Packaging Materials,” 5th National Symposium, Institute of Electronics Enginee, 1999, p 317.
S.-J. Park, M.-K. Seo, J.-R. Lee, and D.-R. Lee, J. Polym. Sci., Part A: Polym. Chem., 39, 187 (2001).
F. Ricciardi, W. A. Romanchick, and M. M. Joullié, J. Polym. Sci., Polym. Lett. Ed., 21, 633 (1983).
S.-J. Park and G.-Y. Heo, Macromol. Chem. Phys., 206, 1134 (2005).
S.-J. Park, T.-J. Kim, and J.-R. Lee, J. Polym. Sci., Part B: Polym. Chem., 38, 2114 (2000).
H. Cai, P. Li, G. Sui, Y. Yu, G. Li, X. Yang, and S. Ryu, Thermochim. Acta, 473, 101 (2008).
L. Núñez, M. R. Núñez, M. Villanueva, A. Castro, and B. Rial, J. Appl. Polym. Sci., 85, 366 (2002).
N. Galego and F. González, Polym. Int., 40, 213 (1996).
M. S. Heise and G. C. Martin, Macromolecules, 22, 99 (1989).
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Chen, KL., Lin, HC., Huang, CS. et al. Amphiphatic Piperazine, Pyrazine, and Pyridine Derivaties as the Thermal Latency for Epoxy-Phenolic Resins. Polym J 41, 685–690 (2009). https://doi.org/10.1295/polymj.PJ2009058
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DOI: https://doi.org/10.1295/polymj.PJ2009058