Abstract
In attempt to produce high modulus and high strength fibers with high electric conductivity, copper plating on the surface of poly(p-phenylenebenzobisoxazole) (PBO) fiber was carried out by using electroless plating, since PBO is a super-heat resistant polymer with the highest Young’s modulus among polymers but is an insulator. The mechanical and electrical properties of the plated fibers were investigated as a function of copper content. At the maximum volume fraction of copper, ca. 30.1 vol %, the electric conductivity reached 105.1 S/cm and the corresponding Young’s modulus was ca. 130 GPa. The stress distribution in the radial direction within the plated fiber was calculated on the basis of a continuous mechanical theory, when external stress was applied along the plated fiber axis. The calculated stress gap at the boundary between PBO and copper phases became larger with increasing copper content. However, the peeling phenomenon at the boundary did not occur under the elongation up to breaking, indicating that the adhesion between the copper and PBO phases is enough to conquer the stress concentration at the boundary under the external applied excitation.
Similar content being viewed by others
Article PDF
References
T. Kitagawa, H. Murase, and K. Yabuki, J. Polym. Sci., Part B: Polym. Phys., 36, 39 (1998).
K. Saito, Y. Takahashi, and M. Sorai, J. Polym. Sci., Part B: Polym. Phys., 38, 1584 (2000).
S. J. Krause, T. B. Haddock, D. L. Vezie, P. G. Lenhert, W. F. Hwang, G. E. Price, T. E. Helminiak, J. F. O’Brien, and W. W. Adams, Polymer, 29, 1354 (1988).
D. C. Martin and E. L. Thomas, Macromolecules, 24, 2450 (1991).
S. Kumar, S. Warner, D. T. Grubb, and W. W. Adams, Polymer, 35, 5408 (1994).
M. E. Hunsaker, G. E. Price, and S. J. Bai, Polymer, 33, 2128 (1992).
S. J. Bai and G. E. Price, Polymer, 33, 2136 (1992).
M. Matsuoka and C. J. Iwakura, J. Electrochem. Soc., 139, 2466 (1992).
F. Caturla, F. Molina, M. Molina-Sabio, and J. Rodriguez-Reinoso, J. Electrochem. Soc., 142, 4084 (1995).
S. J. Park, Y. S. Jang, and K. Y. Rhee, J. Colloid Interface Sci., 245, 383 (2002).
G. M. Wu and Y. T. Shyng, Composites Part A, 35, 1291 (2004).
M. Matsuo and C. Sawatari, Macromolecules, 21, 1658 (1988).
M. Matsuo, Macromolecules, 23, 3261 (1990).
M. Matsuo, C. Sawatari, Y. Iwai, and F. Ozaki, Macromolecules, 23, 3266 (1990).
M. Matsuo, R. Adachi, X. Jiang, and Y. Bin, Macromolecules, 37, 1324 (2004).
Y. Bin, K. Ooishi, K. Yoshida, T. Nakashima, and M. Matsuo, Polym. J., 36, 394 (2004).
Y. Bin, K. Ooishi, K. Yoshida, and M. Matsuo, Polym. J., 36, 888 (2004).
M. Matsuo, T. Ogita, S. Suehiro, T. Yamada, and H. Kawai, Macromolecules, 11, 521 (1978).
M. Matsuo, J. Chem. Phys., 72, 899 (1980).
M. Matsuo and C. Sawatari, Macromolecules, 21, 1653 (1988).
M. Matsuo, Y. Bin, and M. Nakano, Polymer, 42, 4687 (2001).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Matsuo, M., Ishikawa, H., Xi, Y. et al. High Modulus and High Strength Fibers with High Electric Conductivity Prepared by Copper Electroless Plating on the Surface of Poly(p-phenylenebenzobisoxazole) (PBO). Polym J 39, 389–396 (2007). https://doi.org/10.1295/polymj.PJ2006161
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1295/polymj.PJ2006161