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Letter
Nature Materials 2, 532–536 (1 August 2003) | doi:10.1038/nmat944
Dynamic microscopy of nanoscale cluster growth at the solid|[ndash]|liquid interface
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Abstract
Dynamic processes at the solid–liquid interface are of key importance across broad areas of science and technology. Electrochemical deposition of copper, for example, is used for metallization in integrated circuits, and a detailed understanding of nucleation, growth and coalescence is essential in optimizing the final microstructure.
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