Nanoporous glasses are widely used as low-k dielectrics in microelectronic devices, but are susceptible to fracture, leading to failure of the device. New work shows how reactive fracture in these materials can be controlled by appropriate choice of solution chemistry during device processing.
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Cook, R. Controlling crack propagation. Nature Mater 3, 15–16 (2004). https://doi.org/10.1038/nmat1048
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DOI: https://doi.org/10.1038/nmat1048