Development of heat-responsive adhesive materials that are stable during use and quickly deteriorate during dismantling
In this review article, an overview of recent studies on heat-responsive and photoresponsive adhesive materials and the characteristics of other external stimuli used for dismantlable adhesive systems are described. Then, research on dismantlable adhesive materials using polyperoxides is introduced as an example of early material design. Next, the development of a dual-stimuli responsive dismantlable adhesive material is interpreted as a material design for achieving stability during use and degradability during dismantling. Finally, recent studies on heat-responsive, dismantlable adhesive materials, which are thermally stable during use while responding quickly during disassembly by heating, are described.