First issue cover showing a purple background with hand drawn electrical engineering elements in the foreground.

June issue is out!

Integrated photonic neuromorphic computing, neural architecture for in-deep learning accelerators, flat optics for information processing and bio-imaging, quantum dot light-emitting diodes and more

Announcements

  • AEFM 2024

    Join us at AEFM 2024: Advanced Epitaxy for Freestanding Membranes and 2D Materials organized by The University of Tokyo!

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  • Recent advancements in generative AI require multimodal information processing that incorporates images, videos and audio. This shift underscores the importance of integrating AI with robotics to address challenges such as Moravec’s paradox.

    • Tetsuya Ogata
    Comment
  • Efficient heat dissipation is crucial for electronics. Interfacial thermal resistance (ITR) poses considerable challenges that require innovative solutions. Machine learning approaches could enhance ITR predictions by analysing large datasets to guide the development of inorganic, amorphous and 2D materials for advanced thermal management in next-generation electronic devices.

    • Yen-Ju Wu
    Comment
  • 2.5D/3D technologies require designers to reduce electrostatic discharge (ESD) protection of the internal I/O interfaces. To avoid over-design of ESD protection, designers require a more fundamental understanding of the ESD events that occur at this level. Here we present insights, practical guidelines and research directions for circuit designers and suppliers of bonding tools.

    • Shih-Hsiang (Shane) Lin
    • Marko Simicic
    • Nicolas Pantano
    Comment
  • Sensors are extensively used in the Internet of Things (IoT) applications, enhancing daily convenience but also raising concerns about privacy leakage. To address this, we advocate for protecting data privacy at the moment it is generated by sensors, rather than trying to secure it afterwards.

    • Xiaoyu Ji
    • Wenjun Zhu
    • Wenyuan Xu
    Comment