Volume 2 Issue 1, January 2019

Volume 2 Issue 1

Microsystems compress for success

Two-dimensional shapes made of a layer of piezoelectric polymer sandwiched between metal electrodes can be converted into sophisticated three-dimensional microsystems that have a range of applications through a compressive buckling process. The cover shows a scanning electron microscopy image of a fractal curve structure with a very low stiffness that was created using the process.

See Han et al. and News & Views by Haghiashtiani et al.

Image: John A. Rogers, Northwestern University. Cover Design: Allen Beattie.

Editorial

Comment & Opinion

Books & Arts

Research Highlights

News & Views

  • News & Views |

    A nanolithography technique that uses a heated scanning probe tip can precisely pattern metal electrodes on two-dimensional semiconductors, creating field-effect transistors with exceptional performance.

    • Qiyuan He
    •  & Hua Zhang
  • News & Views |

    The compressive buckling of lithographically defined, two-dimensional patterns can create three-dimensional piezoelectric microsystems with a range of potential applications.

    • Ghazaleh Haghiashtiani
    •  & Michael C. McAlpine

Research

  • Article |

    Thermal scanning probe lithography can be used to pattern metal electrodes in direct contact with monolayer MoS2, creating field-effect transistors that exhibit vanishing Schottky barrier heights, high on/off ratios of 1010, no hysteresis, and subthreshold swings as low as 64 mV per decade.

    • Xiaorui Zheng
    • , Annalisa Calò
    • , Edoardo Albisetti
    • , Xiangyu Liu
    • , Abdullah Sanad M. Alharbi
    • , Ghidewon Arefe
    • , Xiaochi Liu
    • , Martin Spieser
    • , Won Jong Yoo
    • , Takashi Taniguchi
    • , Kenji Watanabe
    • , Carmela Aruta
    • , Alberto Ciarrocchi
    • , Andras Kis
    • , Brian S. Lee
    • , Michal Lipson
    • , James Hone
    • , Davood Shahrjerdi
    •  & Elisa Riedo
  • Article |

    Nonlinear buckling processes can be used to transform thin films of piezoelectric polymers into sophisticated 3D piezoelectric microsystems with applications in energy harvesting, multifunctional sensing and bio-integrated devices.

    • Mengdi Han
    • , Heling Wang
    • , Yiyuan Yang
    • , Cunman Liang
    • , Wubin Bai
    • , Zheng Yan
    • , Haibo Li
    • , Yeguang Xue
    • , Xinlong Wang
    • , Banu Akar
    • , Hangbo Zhao
    • , Haiwen Luan
    • , Jaeman Lim
    • , Irawati Kandela
    • , Guillermo A. Ameer
    • , Yihui Zhang
    • , Yonggang Huang
    •  & John A. Rogers

Reverse Engineering

  • Reverse Engineering |

    Edge computing processes data on infrastructure that is located close to the point of data creation. Mahadev Satyanarayanan recounts how recognition of the potential limitations of centralized, cloud-based processing led to this new approach to computing.

    • Mahadev Satyanarayanan