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Volume 2 Issue 1, January 2019

Microsystems compress for success

Two-dimensional shapes made of a layer of piezoelectric polymer sandwiched between metal electrodes can be converted into sophisticated three-dimensional microsystems that have a range of applications through a compressive buckling process. The cover shows a scanning electron microscopy image of a fractal curve structure with a very low stiffness that was created using the process.

See Han et al. and News & Views by Haghiashtiani et al.

Image: John A. Rogers, Northwestern University. Cover Design: Allen Beattie.

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News & Views

  • A nanolithography technique that uses a heated scanning probe tip can precisely pattern metal electrodes on two-dimensional semiconductors, creating field-effect transistors with exceptional performance.

    • Qiyuan He
    • Hua Zhang
    News & Views
  • The compressive buckling of lithographically defined, two-dimensional patterns can create three-dimensional piezoelectric microsystems with a range of potential applications.

    • Ghazaleh Haghiashtiani
    • Michael C. McAlpine
    News & Views
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Reverse Engineering

  • Edge computing processes data on infrastructure that is located close to the point of data creation. Mahadev Satyanarayanan recounts how recognition of the potential limitations of centralized, cloud-based processing led to this new approach to computing.

    • Mahadev Satyanarayanan
    Reverse Engineering
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