
May issue now out
This month’s issue features van der Waals contacts between 2D semiconductors and 3D metals, topological integrated circuits for 5G wireless systems, and quantum computing without quantum computers.
This month’s issue features van der Waals contacts between 2D semiconductors and 3D metals, topological integrated circuits for 5G wireless systems, and quantum computing without quantum computers.
This Review examines the development of micro-thermoelectric devices, exploring progress in device design, integration and performance, and the potential applications of the technology in cooling, power generation and sensing.