Fig. 5: Micro-hardness, microstructural evolutions and conductivity of the swaged copper with ε = 2.5 in the rod center during isothermal and isochronal annealing process. | Communications Materials

Fig. 5: Micro-hardness, microstructural evolutions and conductivity of the swaged copper with ε = 2.5 in the rod center during isothermal and isochronal annealing process.

From: Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire

Fig. 5

a Isothermal annealing at 473, 523, and 573 K (the error bar represents the standard deviation of hardness). b Isochronal annealing for 30 min at temperatures from 300 to 673 K (the error bar represents the standard deviation of hardness). c EBSD and TEM images of annealed side-view structure. d Conductivity of CG, swaged and annealed copper (the error bar represents the standard deviation of conductivity).

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