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Thermal conductivity of materials under pressure

Nature Reviews Physics volume 4, pages 319–335 (2022)Cite this article

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Abstract

The thermal conductivities of materials are extremely important for many practical applications, such as in understanding the thermal balance and history of the Earth, energy conversion of devices and thermal management of electronics. However, measurements of the thermal conductivity of materials under pressure and understanding of associated thermal transport mechanisms remain some of the most difficult challenges and complex topics in high-pressure research. Breakthroughs in high-pressure experimental techniques enable in situ measurements of thermal conductivity at extreme pressure–temperature conditions. This new capability provides not only a unique insight to understand thermal transport mechanisms in materials but also opportunities to realize reversible modulation of materials’ thermal properties. In this Review, we discuss recent progresses in characterization techniques developed at high pressures, in the determination of the thermal conductivity of gases, liquids and solids, as well as in establishing the correlated thermal transport mechanisms. In addition, we focus on the applications of high-pressure and high-temperature experimental simulations of materials in the Earth’s interior.

Key points

  • Thermal characterization techniques have been developed in apparatus such as piston–cylinder cells, multi-anvil cells and diamond anvil cells, for both bulk and thin-film materials, and for both temperature-dependent and pressure-dependent measurements.

  • Such high-pressure thermal characterization techniques have been applied to gases, liquids and solids, including thermoelectric materials, Earth materials and semiconductor materials.

  • The results of the high-pressure thermal conductivities of various materials are summarized, and the underlying thermal transport mechanisms are discussed.

  • Practical applications are given on high-pressure and high-temperature experimental simulations of materials in the Earth’s interior.

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Fig. 1: Thermal transport in materials at ambient and high pressures.
Fig. 2: Steady-state thermal characterization methodologies used under pressure.
Fig. 3: Transient thermal characterization methodologies used under pressure.
Fig. 4: Thermal conductivity of gases, liquids and thermoelectric materials under pressure.
Fig. 5: Thermal conductivity of Earth materials under pressure.
Fig. 6: Thermal conductivity of semiconducting electronic materials under pressure.

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Acknowledgements

The authors thank H.-K. Mao for the encouragement in the technique development and research. The Center for High Pressure Science & Technology Advanced Research (HPSTAR, Shanghai), Harbin Institute of Technology (HIT, Shenzhen), Academia Sinica (Taipei) and the Carnegie Institution for Science (Washington DC) are gratefully acknowledged for support. This work is funded through the Shenzhen Science and Technology Program (grant no. KQTD2020082011304508) and the Basic Research Program of Shenzhen (grant no. JCYJ20200109112810241) at HIT and the National Key R&D Program of China (grant no. 2018YFA0305900) at HPSTAR. W.-P.H. acknowledges support from Academia Sinica and the Ministry of Science and Technology of Taiwan under contracts AS-CDA-106-M02 and 107-2628-M-001-004-MY3, as well as the fellowship from the Foundation for the Advancement of Outstanding Scholarship of Taiwan. The work at Carnegie is supported by the US National Science Foundation (grant nos. EAR-1763287 and EAR-2049127).

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Authors and Affiliations

  1. Center for High Pressure Science & Technology Advanced Research, Shanghai, China

    Yan Zhou, Zuo-Yuan Dong & Xiao-Jia Chen

  2. Institute of Earth Sciences, Academia Sinica, Taipei, Taiwan

    Wen-Pin Hsieh

  3. Earth and Planets Laboratory, Carnegie Institution for Science, Washington, DC, USA

    Alexander F. Goncharov

  4. School of Science, Harbin Institute of Technology, Shenzhen, China

    Xiao-Jia Chen

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  1. Yan Zhou
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Contributions

X.-J.C. designed the project and developed the outline of this work. Y.Z., Z.-Y.D. and X.-J.C. compiled all the data in the tables. Z.-Y.D. and Y.Z. drew the figures. All authors contributed to the discussion of content and the preparation of the manuscript in collaboration.

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Correspondence to Xiao-Jia Chen.

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Zhou, Y., Dong, ZY., Hsieh, WP. et al. Thermal conductivity of materials under pressure. Nat Rev Phys 4, 319–335 (2022). https://doi.org/10.1038/s42254-022-00423-9

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