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Building 3D integrated circuits with electronics and photonics

Nature Electronics volume 7, pages 422–424 (2024)Cite this article

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The three-dimensional integration of electronic and photonic integrated circuits could solve critical input/output limitations in existing computing chips, and create larger, more complex chips for application in future data centres and high-performance systems.

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Fig. 1: Interconnect distances and electrical wiring length dependence for connectivity solutions.

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Authors and Affiliations

  1. Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong, China

    Chao Xiang

  2. Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, CA, USA

    John E. Bowers

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  1. Chao Xiang
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  2. John E. Bowers
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Correspondence to Chao Xiang.

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The authors declare no competing interests.

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Xiang, C., Bowers, J.E. Building 3D integrated circuits with electronics and photonics. Nat Electron 7, 422–424 (2024). https://doi.org/10.1038/s41928-024-01187-z

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