Abstract
Data-driven algorithms—such as signal processing and artificial neural networks—are required to process and extract meaningful information from the massive amounts of data currently being produced in the world. This processing is, however, limited by the traditional von Neumann architecture with its physical separation of processing and memory, which motivates the development of in-memory computing. Here we report an integrated 32 × 32 vector–matrix multiplier with 1,024 floating-gate field-effect transistors that use monolayer molybdenum disulfide as the channel material. In our wafer-scale fabrication process, we achieve a high yield and low device-to-device variability, which are prerequisites for practical applications. A statistical analysis highlights the potential for multilevel and analogue storage with a single programming pulse, allowing our accelerator to be programmed using an efficient open-loop programming scheme. We also demonstrate reliable, discrete signal processing in a parallel manner.
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Data availability
The data that support the findings of this study are available via Zenodo at https://doi.org/10.5281/zenodo.8383470.
References
Xu, X. et al. Scaling for edge inference of deep neural networks. Nat. Electron. 1, 216–222 (2018).
Kestor, G., Gioiosa, R., Kerbyson, D. J. & Hoisie, A. Quantifying the energy cost of data movement in scientific applications. In 2013 IEEE International Symposium on Workload Characterization (IISWC) 56–65 (IEEE, 2013).
Sebastian, A., Le Gallo, M., Khaddam-Aljameh, R. & Eleftheriou, E. Memory devices and applications for in-memory computing. Nat. Nanotechnol. 15, 529–544 (2020).
McKee, S. A. Reflections on the memory wall. In Proc. 1st Conference on Computing Frontiers—CF’04 162 (ACM Press, 2004).
Sun, Z., Pedretti, G., Bricalli, A. & Ielmini, D. One-step regression and classification with cross-point resistive memory arrays. Sci. Adv. 6, eaay2378 (2020).
Sun, Z. et al. Solving matrix equations in one step with cross-point resistive arrays. Proc. Natl Acad. Sci. USA 116, 4123–4128 (2019).
Zidan, M. A. et al. A general memristor-based partial differential equation solver. Nat. Electron. 1, 411–420 (2018).
Li, C. et al. Analogue signal and image processing with large memristor crossbars. Nat. Electron. 1, 52–59 (2018).
Lin, P. et al. Three-dimensional memristor circuits as complex neural networks. Nat. Electron. 3, 225–232 (2020).
Wang, Z. et al. Reinforcement learning with analogue memristor arrays. Nat. Electron. 2, 115–124 (2019).
Yao, P. et al. Fully hardware-implemented memristor convolutional neural network. Nature 577, 641–646 (2020).
Wang, Z. et al. Fully memristive neural networks for pattern classification with unsupervised learning. Nat. Electron. 1, 137–145 (2018).
Khaddam-Aljameh, R. et al. HERMES-Core—a 1.59-TOPS/mm2 PCM on 14-nm CMOS in-memory compute core using 300-ps/LSB linearized CCO-based ADCs. IEEE J. Solid-State Circuits 57, 1027–1038 (2022).
Jung, S. et al. A crossbar array of magnetoresistive memory devices for in-memory computing. Nature 601, 211–216 (2022).
Berdan, R. et al. Low-power linear computation using nonlinear ferroelectric tunnel junction memristors. Nat. Electron. 3, 259–266 (2020).
Ielmini, D. & Wong, H.-S. P. In-memory computing with resistive switching devices. Nat. Electron. 1, 333–343 (2018).
Bavandpour, M., Sahay, S., Mahmoodi, M. R. & Strukov, D. B. 3D-aCortex: an ultra-compact energy-efficient neurocomputing platform based on commercial 3D-NAND flash memories. Neuromorph. Comput. Eng. 1, 014001 (2021).
Merrikh-Bayat, F. et al. High-performance mixed-signal neurocomputing with nanoscale floating-gate memory cell arrays. IEEE Trans. Neural Netw. Learn. Syst. 29, 4782–4790 (2018).
Radisavljevic, B., Radenovic, A., Brivio, J., Giacometti, V. & Kis, A. Single-layer MoS2 transistors. Nat. Nanotechnol. 6, 147–150 (2011).
Ciarrocchi, A. et al. Polarization switching and electrical control of interlayer excitons in two-dimensional van der Waals heterostructures. Nat. Photon. 13, 131–136 (2019).
Bertolazzi, S., Krasnozhon, D. & Kis, A. Nonvolatile memory cells based on MoS2/graphene heterostructures. ACS Nano 7, 3246–3252 (2013).
Sangwan, V. K. et al. Gate-tunable memristive phenomena mediated by grain boundaries in single-layer MoS2. Nat. Nanotechnol. 10, 403–406 (2015).
Shen, P.-C., Lin, C., Wang, H., Teo, K. H. & Kong, J. Ferroelectric memory field-effect transistors using CVD monolayer MoS2 as resistive switching channel. Appl. Phys. Lett. 116, 033501 (2020).
Desai, S. B. et al. MoS2 transistors with 1-nanometer gate lengths. Science 354, 99–102 (2016).
Paliy, M., Strangio, S., Ruiu, P. & Iannaccone, G. Assessment of two-dimensional materials-based technology for analog neural networks. IEEE J. Explor. Solid-State Computat. 7, 141–149 (2021).
Feng, X. et al. Self-selective multi-terminal memtransistor crossbar array for in-memory computing. ACS Nano 15, 1764–1774 (2021).
Migliato Marega, G. et al. Low-power artificial neural network perceptron based on monolayer MoS2. ACS Nano 16, 3684–3694 (2022).
Mennel, L. et al. Ultrafast machine vision with 2D material neural network image sensors. Nature 579, 62–66 (2020).
Giusi, G., Marega, G. M., Kis, A. & Iannaccone, G. Impact of interface traps in floating-gate memory based on monolayer MoS. IEEE Trans. Electron Devices 69, 6121–6126 (2022).
Cao, W., Kang, J., Bertolazzi, S., Kis, A. & Banerjee, K. Can 2D-nanocrystals extend the lifetime of floating-gate transistor based nonvolatile memory? IEEE Trans. Electron Devices 61, 3456–3464 (2014).
Hu, V. P.-H. et al. Energy-efficient monolithic 3-D SRAM cell with BEOL MoS2 FETs for SoC scaling. IEEE Trans. Electron Devices 67, 4216–4221 (2020).
Migliato Marega, G. et al. Logic-in-memory based on an atomically thin semiconductor. Nature 587, 72–77 (2020).
Zhu, K. et al. Hybrid 2D–CMOS microchips for memristive applications. Nature 618, 57–62 (2023).
Hinton, H. et al. A 200 ×256 image sensor heterogeneously integrating a 2D nanomaterial-based photo-FET array and CMOS time-to-digital converters. In 2022 IEEE International Solid-State Circuits Conference (ISSCC) 65, 1–3 (IEEE, 2022).
Dodda, A. et al. Active pixel sensor matrix based on monolayer MoS2 phototransistor array. Nat. Mater. 21, 1379–1387 (2022).
Jang, H. et al. An atomically thin optoelectronic machine vision processor. Adv. Mater. 32, 2002431 (2020).
Ma, S. et al. A 619-pixel machine vision enhancement chip based on two-dimensional semiconductors. Sci. Adv. 8, eabn9328 (2022).
Yu, L. et al. Design, modeling, and fabrication of chemical vapor deposition grown MoS2 circuits with E-mode FETs for large-area electronics. Nano Lett. 16, 6349–6356 (2016).
Ma, S. et al. An artificial neural network chip based on two-dimensional semiconductor. Sci. Bull. 67, 270–277 (2022).
Wang, X. et al. Analog and logic circuits fabricated on a wafer-scale two-dimensional semiconductor. In 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) 1–2 (IEEE, 2022).
Polyushkin, D. K. et al. Analogue two-dimensional semiconductor electronics. Nat. Electron. 3, 486–491 (2020).
Wachter, S., Polyushkin, D. K., Bethge, O. & Mueller, T. A microprocessor based on a two-dimensional semiconductor. Nat. Commun. 8, 14948 (2017).
Chen, S. et al. Wafer-scale integration of two-dimensional materials in high-density memristive crossbar arrays for artificial neural networks. Nat. Electron. 3, 638–645 (2020).
Acknowledgements
We thank Z. Benes (CMI) for help with the electron-beam lithography and R. Chiesa for assistance with the energy-dispersive X-ray measurements. Device preparation was carried out in the EPFL Centre of MicroNanotechnology (CMI). We thank B. Bartova and R. Therisod (CIME) for device cross-sectioning and transmission electron microscopy imaging, which were carried out at the EPFL Interdisciplinary Centre for Electron Microscopy (CIME). We acknowledge support from the European Union’s Horizon 2020 research and innovation programme under grant agreement nos. 829035 QUEFORMAL (to G.M.M., Z.W. and A.K.), 785219 and 881603 (Graphene Flagship Core 2 and Core 3) to A.K. and 964735 (EXTREME-IR) to H.J and A.K.; the European Research Council (ERC, grant nos. 682332 and 899775, to H.J., M.T. and A.K.); the CCMX Materials Challenge grant ‘Large area growth of 2D materials for device integration’ (to A.R. and A.K.); and the Swiss National Science Foundation (grant no. 175822, to G.P. and A.K.).
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A.K. initiated and supervised the project. G.M.M. fabricated the devices, designed/prepared the measurement setup and performed the device characterization and remaining measurements. H.J. and Z.W. grew the 2D materials and assisted in materials characterization under the supervision of A.R. M.T. performed the high-resolution transmission electron microscopy for the characterization of devices and materials. G.P. performed the atomic force microscopy imaging and elemental characterization. A.K. and G.M.M. analysed the data. The manuscript was written by G.M.M. and A.K. with input from all authors.
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Nature Electronics thanks Su-Ting Han, Jing-Kai Huang and the other, anonymous, reviewer(s) for their contribution to the peer review of this work.
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Migliato Marega, G., Ji, H.G., Wang, Z. et al. A large-scale integrated vector–matrix multiplication processor based on monolayer molybdenum disulfide memories. Nat Electron (2023). https://doi.org/10.1038/s41928-023-01064-1
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DOI: https://doi.org/10.1038/s41928-023-01064-1