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Three-dimensional flexible electronics using solidified liquid metal with regulated plasticity

Nature Electronics volume 6, pages 154–163 (2023)Cite this article

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Abstract

Liquid metals based on gallium alloy are of potential use in the development of soft and stretchable electronics due to their intrinsic fluidity and high conductivity. However, it is challenging to build three-dimensional circuits using liquid metals, which limits the complexity and integration of the resulting devices. Here we show that a gallium–indium alloy can be used to fabricate flexible electronics with three-dimensional circuits by exploiting the solid–liquid phase transition and plastic deformation of the liquid metal. Solid but plastically deformable alloy wires are shaped into circuits at low temperatures (under 15 °C) and encapsulated in an elastomer, before being heated above their melting temperature. Subsequently, the supercooling effect allows the alloy to maintain a liquid state at a wide range of temperatures, including below the melting point. We use the technique to fabricate high-sensitivity strain sensors, three-dimensional interconnect arches for integrating an array of light-emitting diodes, and a three-dimensional wearable sensor and multilayer flexible circuit board for monitoring finger motion.

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Fig. 1: Strategy for the fabrication of 3D flexible electronics based on solidified LMs with regulated plasticity.
Fig. 2: Microstructure characterization and performance tests of hypoeutectic Ga–In alloys.
Fig. 3: Electromechanical tests performed on the 2D strain sensor and the design of a high-sensitivity strain sensor with 3D circuit.
Fig. 4: Ga–10In 3D interconnect arch and its example use in an LED array.
Fig. 5: Design and fabrication of 3D structured wearable finger movement detection sensor and multilayer flexible circuit board using Ga–10In solid wire.

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Data availability

The data that support the findings of this study are available from the corresponding authors upon reasonable request.

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Acknowledgements

G.L. and Z.L. acknowledge support from the National Key Research and Development Program of China (grant no. 2021YFF0501601), the National Natural Science Foundation of China (grant nos. 81927804 and U1913601) and NSFC-Shenzhen Robotics Basic Research Center Program (grant no. U2013207). X.M. recognizes funding from Shenzhen Science and Technology Program (grant no. KQTD20170809110344233), Shenzhen Bay Laboratory (grant no. SZBL201906281005) and the National Natural Science Foundation of China (grant no. 92163109). We thank L. Shi for guiding the circuit design of the flexible circuit board.

Author information

Authors and Affiliations

  1. Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, China

    Guoqiang Li, Mingyang Zhang, Man Yuan, Junjie Wu & Xing Ma

  2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China

    Sanhu Liu & Zhiwu Xu

  3. Research Center for Neural Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China

    Mei Yu, Lijun Teng, Guanglin Li & Zhiyuan Liu

  4. Shenzhen Key Laboratory of Smart Sensing and Intelligent Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China

    Mei Yu, Lijun Teng, Guanglin Li & Zhiyuan Liu

  5. School of Sensing Science and Engineering, Shanghai Jiaotong University, Shanghai, China

    Jinhong Guo

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Contributions

G.L. conceived the project, designed the experiments, prepared the 2D/3D structured sensors and analysed the data. M.Z. and S.L. characterized the microstructures of Ga–In alloys. M.Y. and J.W. prepared the 3D structured wearable sensor. L.T. designed and prepared the LED array. X.M. and Z.L. supervised this work. All the authors discussed and commented on the manuscript.

Corresponding authors

Correspondence to Zhiyuan Liu or Xing Ma.

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Nature Electronics thanks the anonymous reviewers for their contribution to the peer review of this work.

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Supplementary information

Supplementary Information

Supplementary Figs. 1–27, Table 1, Notes 1–7 and references.

Supplementary Video 1

Preparation method of Ga–10In solid wire.

Supplementary Video 2

Bending experiment to compare the plasticity between Ga–10In and Ga–15In solid wire.

Supplementary Video 3

Dynamic processes of crystallizing and melting of Ga–10In solid wire.

Supplementary Video 4

Comparison of the stiffness between pure Ga and Ga–10In alloys.

Supplementary Video 5

Timing and sequence for turning the LED array on and off.

Supplementary Video 6

Fabrication process of 3D helical conductive structure using an automatic winding machine.

Supplementary Video 7

A 3D structured sensor for detecting finger movement and performing thermal therapy.

Supplementary Video 8

Wearable and wireless finger motion detection device.

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Li, G., Zhang, M., Liu, S. et al. Three-dimensional flexible electronics using solidified liquid metal with regulated plasticity. Nat Electron 6, 154–163 (2023). https://doi.org/10.1038/s41928-022-00914-8

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