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Power electronics

All-around diamond for cooling power devices

High-electron-mobility transistors with a diamond coating on their top and side surfaces can effectively dissipate heat in high-power electronics applications.

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Fig. 1: Schematic of the AlGaN/GaN HEMT with all-around diamond integration.

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Correspondence to Jae-Hyun Ryou or Sukwon Choi.

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Ryou, JH., Choi, S. All-around diamond for cooling power devices. Nat Electron 5, 834–835 (2022). https://doi.org/10.1038/s41928-022-00896-7

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