Three-dimensional computing systems made of vertically integrated complementary metal–oxide–semiconductor circuits and layered resistive memory can perform analogue computing-in-memory with high energy efficiency.
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Yeo, I., Seo, Js. Resistive memories stack up. Nat Electron 5, 414–415 (2022). https://doi.org/10.1038/s41928-022-00804-z
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DOI: https://doi.org/10.1038/s41928-022-00804-z