Correction to: Scientific Reports https://doi.org/10.1038/s41598-019-40268-4, published online 06 March 2019
In the Supplementary Information file originally published with this Article, some text was inappropriately used and cited. These errors have been corrected in the Supplementary Information that now accompanies the Article.
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Shen, YA., Lin, CM., Li, J. et al. Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder. Sci Rep 10, 12229 (2020). https://doi.org/10.1038/s41598-020-67126-y
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DOI: https://doi.org/10.1038/s41598-020-67126-y
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