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Photonic van der Waals integration from 2D materials to 3D nanomembranes

Nature Reviews Materials volume 8, pages 498–517 (2023)Cite this article

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Abstract

The integration of functional nanomaterials and heterostructures with photonic architectures has laid the foundation for important photonic and optoelectronic applications. The advent of epitaxy and layer lift-off techniques has enabled a wide spectrum of two-dimensional materials and three-dimensional single-crystalline freestanding thin films with diverse optical functionalities, featuring van der Waals (vdW) interfaces suitable for photonic vdW integration. Physical assembly leveraging vdW interactions eliminates the constraints of epitaxial lattice-matching, introducing unprecedented freedom to combine dissimilar materials with appealing optoelectronic properties but radically distinct crystal structures. Various prefabricated vdW building blocks can be combined in novel hetero-integrated photonic architectures and hybrid vdW heterostructures to prototype new devices and explore exotic nanophotonic phenomena at mixed-dimensional vdW interfaces. The ultrathin nature of these freestanding nanomembranes also enables flexible and lightweight photonic devices for low-cost wearable and multifunctional health-care applications. In this Review, we survey the recent progress in photonic nanomembranes with vdW interfaces, discussing a broad range of delaminated freestanding nanomembranes from film preparation to device implementation. We also analyse the remaining challenges and highlight emerging opportunities for advanced vdW hetero-integration.

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Fig. 1: Freestanding functional nanomembranes for photonic vdW integration.
Fig. 2: Fundamental properties of photonic vdW films.
Fig. 3: Preparation of freestanding optical films.
Fig. 4: Applications of 2D photonic vdW films.
Fig. 5: Applications of 3D photonic vdW films.
Fig. 6: Photonic applications of vdW heterostructures.
Fig. 7: Perspectives for freestanding nanomembranes for photonic vdW integration.

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Acknowledgements

S.-H.B. thanks the Institute of Materials Science and Engineering (IMSE), Washington University in St Louis, for support. C.-W.Q. acknowledges support from the National Research Foundation Singapore (CRP26-2021-0004). D.-H.K. thanks support from Korea Institute for Advancement of Technology (KIAT) grant funded by the Korea Government (MOTIE) (P0017305, Human Resource Development Program for Industrial Innovation (Global)).

Author information

Author notes

  1. These authors contributed equally: Yuan Meng, Jiangang Feng, Sangmoon Han.

Authors and Affiliations

  1. Mechanical Engineering and Materials Science, Washington University in St Louis, St Louis, MO, USA

    Yuan Meng, Sangmoon Han, Ilpyo Roh & Sang-Hoon Bae

  2. Department of Electrical and Computer Engineering, National University of Singapore, Kent, Ridge, Singapore

    Jiangang Feng, Tan Zhang & Cheng-Wei Qiu

  3. Institute of Materials Science and Engineering, Washington University in St Louis, St Louis, MO, USA

    Zhihao Xu, Justin S. Kim, Lan Yang & Sang-Hoon Bae

  4. Department of Electrical and Systems Engineering, Washington University, St Louis, MO, USA

    Wenbo Mao & Lan Yang

  5. Department of Materials Science and Engineering and California Nano Systems Institute, University of California Los Angeles, Los Angeles, CA, USA

    Yepin Zhao & Yang Yang

  6. School of Chemical Engineering, Sungkyunkwan University, Suwon, South Korea

    Dong-Hwan Kim

  7. Biomedical Institute for Convergence, Sungkyunkwan University, Suwon, Republic of Korea

    Dong-Hwan Kim

  8. Department of Nano Science and Technology and Department of Nanoengineering, SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon, Republic of Korea

    Jin-Wook Lee

  9. SKKU Institute of Energy Science & Technology (SIEST), Sungkyunkwan University, Suwon, Republic of Korea

    Jin-Wook Lee

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  1. Yuan Meng
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Y.M., J.F., S.H., Z.X., T.Z., W.M., Y.Z., J.S.K., I.R., D.-H.K., C.-W.Q. and S.-H.B. researched data for the article. Y.M., J.F., S.-H.B., C.-W.Q. and L.Y. contributed substantially to discussion of the content. Y.M., J.F., S.-H.B., C.-W.Q., L.Y., J.-W.L., S.H., Z.X. and W.M. wrote the article. Y.M., S.-H.B., C.-W.Q., L.Y., J.-W.L. and Y.Y. reviewed and edited the manuscript before submission.

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Correspondence to Jin-Wook Lee, Lan Yang, Cheng-Wei Qiu or Sang-Hoon Bae.

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Meng, Y., Feng, J., Han, S. et al. Photonic van der Waals integration from 2D materials to 3D nanomembranes. Nat Rev Mater 8, 498–517 (2023). https://doi.org/10.1038/s41578-023-00558-w

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