Fig. 3: Resistance vs. bending cycles. | npj Flexible Electronics

Fig. 3: Resistance vs. bending cycles.

From: Bending reliability of screen-printed vias for a flexible energy module

Fig. 3

a Asahi samples bending results. Initial resistance (R0) for each case: 50 µm, 13.4 Ω; 100 µm, 12.8 Ω; 150 µm, 11.9 Ω; 200 µm, 11.5 Ω; Reference tensile, 10.7 Ω; Reference compress 10.5 Ω. b DuPont samples bending results. Initial resistance (R0) for each case: 50 µm, 16.9 Ω; 100 µm, 17.6 Ω; 150 µm, 20.0 Ω; 200 µm, 12.3 Ω; Reference tensile, 9.9 Ω; Reference compress 15.5 Ω.

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