Fig. 2: Schematic of the fabrication process. | Microsystems & Nanoengineering

Fig. 2: Schematic of the fabrication process.

From: Micron-gap spacers with ultrahigh thermal resistance and mechanical robustness for direct energy conversion

Fig. 2

a Photolithography is used to etch ribs of a few micron width in the surface of a silicon sacrificial substrate, and, b after coating and c etching openings in a thin atomic-layer deposited film of alumina, d the spacer is lifted away from the substrate by undercutting the silicon with an isotropic XeF2 etch. In the figure, magenta is the photoresist, blue is the ALD alumina, and grey is the silicon/mold

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