Integrated circuits

Memory grows up

Three-dimensional integration may allow for continued improvements in the speed, density and cost of non-volatile memory.

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Figure 1: Cross-point phase-change memory and 3D NAND flash are competing to provide viable cost-effective solutions for next-generation high-density memories.

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Pirovano, A., Schuegraf, K. Memory grows up. Nature Nanotech 5, 177–178 (2010). https://doi.org/10.1038/nnano.2010.36

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