Direct nanoprinting by liquid-bridge-mediated nanotransfer moulding

Abstract

Several techniques for the direct printing of functional materials have been developed to fabricate micro- and nanoscale structures and devices. We report a new direct patterning method, liquid-bridge-mediated nanotransfer moulding, for the formation of two- or three-dimensional structures with feature sizes as small as tens of nanometres over large areas up to 4 inches across. Liquid-bridge-mediated nanotransfer moulding is based on the direct transfer of various materials from a mould to a substrate through a liquid bridge between them. We demonstrate its usefulness by fabricating nanowire field-effect transistors and arrays of pentacene thin-film transistors.

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Figure 1: Liquid-bridge-mediated nanotransfer moulding.
Figure 2: SEM images of nanoscale patterns (white) of different materials fabricated by LB-nTM on silicon substrates (black).
Figure 3: SEM images of microscale patterns (white) of different materials fabricated by LB-nTM on silicon substrates (black).
Figure 4: ZTO nanowire field-effect transistors.
Figure 5: TIPS-PEN thin-film transistors.

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Acknowledgements

This work was supported by the National Research Foundation of Korea (2009-0092807; 2010-0019125; 2009-0086302), the Seoul R&BD programme (ST090839), the IT R&D program of MKE/KEIT (10030559) and the Korea Research Foundation (KRF-2007-313-C00383).

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M.M.S. conceived and designed the experiments. J.K.H., E.B.K., S.C. and J.M.D. performed the experiments. K.S. and J.M. contributed to materials and analysis. S.C. and M.M.S. co-wrote the paper.

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Correspondence to Myung M. Sung.

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The authors declare no competing financial interests.

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Hwang, J., Cho, S., Dang, J. et al. Direct nanoprinting by liquid-bridge-mediated nanotransfer moulding. Nature Nanotech 5, 742–748 (2010). https://doi.org/10.1038/nnano.2010.175

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