Skip to main content

Thank you for visiting You are using a browser version with limited support for CSS. To obtain the best experience, we recommend you use a more up to date browser (or turn off compatibility mode in Internet Explorer). In the meantime, to ensure continued support, we are displaying the site without styles and JavaScript.

  • News & Views
  • Published:


3D integration advances computing

Integrated circuits usually have only one layer of electronic devices, which limits their performance and functionality. A 3D integrated circuit that incorporates multiple device layers enables a wealth of applications. See Letter p.74

This is a preview of subscription content, access via your institution

Access options

Buy this article

Prices may be subject to local taxes which are calculated during checkout

Figure 1: A prototype 3D integrated circuit.


  1. See all news & views


  1. Shulaker, M. M. et al. Nature 547, 74–78 (2017).

    Article  ADS  CAS  Google Scholar 

  2. Davis, W. R. et al. IEEE Design Test Comput. 22, 498–510 (2005).

    Article  Google Scholar 

  3. Or-Bach, Z. in CHIPS 2020 Vol. 2 (ed. Hoefflinger, B.) 51–91 (Springer, 2016).

    Book  Google Scholar 

  4. Batude, P. et al. Proc. IEEE Electron Devices Meet. 7.3.1–7.3.4 (2011).

  5. Liauw, Y. Y., Zhang, Z., Kim, W., Gamal, A. E. & Wong, S. S. Proc. IEEE Solid-State Circuits Conf. 406–408 (2012).

  6. Golshani, N. et al. Proc. IEEE 3D Systems Integration Conf. (2010).

  7. Patil, N. et al. IEEE Trans. Nanotechnol. 8, 498–504 (2009).

    Article  ADS  Google Scholar 

  8. Hearst, M. A., Dumais, S. T., Osuna, E., Platt, J. & Scholkopf, B. IEEE Intel. Syst. Appl. 13, 18–28 (1998).

    Article  Google Scholar 

  9. Shulaker, M. M. et al. Nature 501, 526–530 (2013).

    Article  ADS  CAS  Google Scholar 

  10. Reda, S., Smith, G. & Smith, L. IEEE Trans. Very Large Scale Integr. Syst. 17, 1357–1362 (2009).

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations


Corresponding author

Correspondence to Sherief Reda.

Related links

Related links

Related links in Nature Research

Applied physics: 3D imaging for microchips

Materials science: Chain mail reverses the Hall effect

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Reda, S. 3D integration advances computing. Nature 547, 38–39 (2017).

Download citation

  • Published:

  • Issue Date:

  • DOI:

This article is cited by


Quick links

Nature Briefing

Sign up for the Nature Briefing newsletter — what matters in science, free to your inbox daily.

Get the most important science stories of the day, free in your inbox. Sign up for Nature Briefing