The future of electronics may rest on devices that integrate other semiconductors with silicon. A means of creating tiny semiconductor pillars on a silicon surface is now demonstrated.
This is a preview of subscription content, access via your institution
Access options
Subscribe to Journal
Get full journal access for 1 year
$199.00
only $3.90 per issue
All prices are NET prices.
VAT will be added later in the checkout.
Tax calculation will be finalised during checkout.
Buy article
Get time limited or full article access on ReadCube.
$32.00
All prices are NET prices.

LARS SAMUELSON
References
Mårtensson, T. et al. Nano Lett. 4, 1987–1990 (2004).
Peercy, P. S. Nature 406, 1023–1026 (2000).
Wagner, R. S. & Ellis, W. C. Appl. Phys. Lett. 4, 89–90 (1964).
Woll, A. R., Rugheimer, P. & Lagally, M. G. Int. J. High-Speed Electron. Syst. 12, 45–78 (2002).
Björk, M. T. et al. Appl. Phys. Lett. 81, 4458–4460 (2002).
Dick, K. A. et al. Nature Mater. 3, 380–384 (2004).
Thelander, C. et al. Appl. Phys. Lett. 83, 2052–2054 (2003).
Scheible, D. V. & Blick, R. H. Appl. Phys. Lett. 84, 4632–4634 (2004).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Lagally, M., Blick, R. A ‘bed of nails’ on silicon. Nature 432, 450–451 (2004). https://doi.org/10.1038/432450a
Published:
Issue Date:
DOI: https://doi.org/10.1038/432450a