Letter | Published:

Substrate Damage in Film Thickness Measurement by Beam Interferometry

Abstract

IN the Tolansky method for the measurement of the thickness of thin films by multiple beam interference we have used a narrow channel in the film rather than a sharp step1. The channel can be formed by gently drawing a needle across the film before the deposition of the reflecting over-layer. The technique is easily applied and has several advantages especially when the substrate is not optically flat as in the case of microscope slides.

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References

  1. 1

    Scott, G. D., McLauchlan, T. A., and Sennett, R. S., J. App. Phys., 21, 843 (1950).

  2. 2

    Weaver, C., and Benjamin, P., Nature, 182, 1149 (1958).

  3. 3

    Scott, G. D., J. Opt. Soc. Amer., 48, 858 (1958).

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