Letter | Published:

Substrate Damage in Film Thickness Measurement by Beam Interferometry


IN the Tolansky method for the measurement of the thickness of thin films by multiple beam interference we have used a narrow channel in the film rather than a sharp step1. The channel can be formed by gently drawing a needle across the film before the deposition of the reflecting over-layer. The technique is easily applied and has several advantages especially when the substrate is not optically flat as in the case of microscope slides.

Access optionsAccess options

Rent or Buy article

Get time limited or full article access on ReadCube.


All prices are NET prices.


  1. 1

    Scott, G. D., McLauchlan, T. A., and Sennett, R. S., J. App. Phys., 21, 843 (1950).

  2. 2

    Weaver, C., and Benjamin, P., Nature, 182, 1149 (1958).

  3. 3

    Scott, G. D., J. Opt. Soc. Amer., 48, 858 (1958).

Download references

Author information

Rights and permissions

Reprints and Permissions

About this article


By submitting a comment you agree to abide by our Terms and Community Guidelines. If you find something abusive or that does not comply with our terms or guidelines please flag it as inappropriate.