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Substrate Damage in Film Thickness Measurement by Beam Interferometry

Abstract

IN the Tolansky method for the measurement of the thickness of thin films by multiple beam interference we have used a narrow channel in the film rather than a sharp step1. The channel can be formed by gently drawing a needle across the film before the deposition of the reflecting over-layer. The technique is easily applied and has several advantages especially when the substrate is not optically flat as in the case of microscope slides.

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References

  1. Scott, G. D., McLauchlan, T. A., and Sennett, R. S., J. App. Phys., 21, 843 (1950).

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  2. Weaver, C., and Benjamin, P., Nature, 182, 1149 (1958).

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  3. Scott, G. D., J. Opt. Soc. Amer., 48, 858 (1958).

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SCOTT, G. Substrate Damage in Film Thickness Measurement by Beam Interferometry. Nature 184, 354–355 (1959). https://doi.org/10.1038/184354b0

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