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Scientific American

January 1, 2002

1 min read

A Vertical Leap for Microchips

Engineers have discovered a way to pack more computing power into microcircuits: build them vertically as well as horizontally

By Thomas H. Lee

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This article was originally published with the title “A Vertical Leap for Microchips” in Scientific American Magazine Vol. 286 No. 1 (January 2002)

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