Focus Review

Polymer Journal (2016) 48, 45–50; doi:10.1038/pj.2015.78; published online 30 September 2015

Lithography process simulation studies using coarse-grained polymer models

Hiroshi Morita1

1CNT-Application Research Center, National Institute of Advanced Industrial Science and Technology (AIST), Ibaraki, Japan

Correspondence: Dr H Morita, CNT-Application Research Center, National Institute of Advanced Industrial Science and Technology (AIST), Central 2-1, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8568, Japan. E-mail: h.morita@aist.go.jp

Received 13 May 2015; Revised 28 July 2015; Accepted 29 July 2015
Advance online publication 30 September 2015

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Abstract

Lithography processes were modeled on the basis of coarse-grained polymer simulation techniques using OCTA, which is the simulation software for soft materials, and the simulations of these processes were performed to clarify the mechanism of the polymer chain dynamics in lithography processes. In the case of the top-down process, the development and rinse processes were modeled using a dissipative particle dynamics method. From our series of simulations, the line pattern constituted by resist polymers can be simulated as a result. In the rinse process, the reduction of line edge roughness (LER) can be found, and the importance of the rinse process to modify the LER was identified. The bottom-up process, which is called the directed self-assembly (DSA) process, can also be simulated. From our DSA process simulations, the polymer chain dynamics in the defect annihilation process can be analyzed.