Article abstract
Nature Nanotechnology 3, 749 - 754 (2008)
Published online: 19 October 2008 | doi:10.1038/nnano.2008.305
Subject Categories: Electronic properties and devices | Molecular self-assembly
Upscaling, integration and electrical characterization of molecular junctions
Paul A. Van Hal1, Edsger C. P. Smits1,2,3, Tom C. T. Geuns1, Hylke B. Akkerman2, Bianca C. De Brito1, Stefano Perissinotto4, Guglielmo Lanzani4, Auke J. Kronemeijer2, Victor Geskin5, Jérôme Cornil5, Paul W. M. Blom2, Bert De Boer2 & Dago M. De Leeuw1,2
Abstract
The ultimate target of molecular electronics is to combine different types of functional molecules into integrated circuits, preferably through an autonomous self-assembly process. Charge transport through self-assembled monolayers has been investigated previously, but problems remain with reliability, stability and yield, preventing further progress in the integration of discrete molecular junctions. Here we present a technology to simultaneously fabricate over 20,000 molecular junctions—each consisting of a gold bottom electrode, a self-assembled alkanethiol monolayer, a conducting polymer layer and a gold top electrode—on a single 150-mm wafer. Their integration is demonstrated in strings where up to 200 junctions are connected in series with a yield of unity. The statistical analysis on these molecular junctions, for which the processing parameters were varied and the influence on the junction resistance was measured, allows for the tentative interpretation that the perpendicular electrical transport through these monolayer junctions is factorized.
- Philips Research Laboratories, High Tech Campus 4, 5656 AE Eindhoven, Netherlands
- Molecular Electronics, Zernike Institute for Advanced Materials, University of Groningen, Nijenborgh 4, 9747 AG Groningen, Netherlands
- Dutch Polymer Institute, PO Box 902, 5600 AX Eindhoven, Netherlands
- IIT Istituto Italiano di Tecnologia, Dipartimento di Fisica, Politecnico di Milano, P.za L. da Vinci 32, 20133, Milano, Italy
- Service de Chimie des Materiaux Nouveaux, Université de Mons-Hainaut, Place du Parc 20, Mons, Belgium
Correspondence to: Dago M. De Leeuw1,2 e-mail: dago.de.leeuw@philips.com
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