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Nature 432, 450-451 (25 November 2004) | doi:10.1038/432450a; Published online 24 November 2004
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Materials science: A 'bed of nails' on silicon
Max G. Lagally1 & Robert H. Blick1
Abstract
The future of electronics may rest on devices that integrate other semiconductors with silicon. A means of creating tiny semiconductor pillars on a silicon surface is now demonstrated.
Computers rely on silicon. Although other semiconductors have desirable features, in this context the materials properties of silicon are so outstanding that it is really the only choice for the large-scale integration of fast electronic devices.
- Max G. Lagally is in the Department of Materials Science and Engineering, and Robert H. Blick is in the Department of Electrical and Computer Engineering, University of Wisconsin–Madison, Madison, Wisconsin 53706, USA.
e-mails: Email: lagally@engr.wisc.edu
Email: blick@engr.wisc.edu
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