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Letters to Nature

Nature 425, 702-705 (16 October 2003) | doi:10.1038/nature02011; Received 5 March 2003; Accepted 19 August 2003

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Zero thermal expansion in YbGaGe due to an electronic valence transition

James R. Salvador1, Fu Guo2, Tim Hogan2 & Mercouri G. Kanatzidis1

  1. Department of Chemistry and Centre for Fundamental Materials Research, Michigan State University, East Lansing, Michigan 48824, USA
  2. Department of Electrical and Computer Engineering, Michigan State University, East Lansing, Michigan 48824, USA

Correspondence to: Mercouri G. Kanatzidis1 Email: kanatzid@cem.msu.edu

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Most materials expand upon heating. Although rare, some materials expand on cooling, and are said to exhibit negative thermal expansion (NTE); but the property is exhibited in only one crystallographic direction. Such materials include silicon and germanium1 at very low temperature (<100 K) and, at room temperature, glasses in the titania–silica family2, Kevlar, carbon fibres, anisotropic Invar Fe-Ni alloys3, ZrW2O3 (ref. 4) and certain molecular networks5. NTE materials can be combined with materials demonstrating a positive thermal expansion coefficient to fabricate composites exhibiting an overall zero thermal expansion (ZTE). ZTE materials are useful because they do not undergo thermal shock on rapid heating or cooling. The need for such composites could be avoided if ZTE materials were available in a pure form. Here we show that an electrically conductive intermetallic compound, YbGaGe, can exhibit nearly ZTE—that is, negligible volume change between 100 and 400 K. We suggest that this response is due to a temperature-induced valence transition in the Yb atoms. ZTE materials are desirable to prevent or reduce resulting strain or internal stresses in systems subject to large temperature fluctuations, such as in space applications and thermomechanical actuators.

  1. Department of Chemistry and Centre for Fundamental Materials Research, Michigan State University, East Lansing, Michigan 48824, USA
  2. Department of Electrical and Computer Engineering, Michigan State University, East Lansing, Michigan 48824, USA

Correspondence to: Mercouri G. Kanatzidis1 Email: kanatzid@cem.msu.edu