Figures and Tables

From the following article:

High tensile ductility in a nanostructured metal

Yinmin Wang, Mingwei Chen, Fenghua Zhou and En Ma

Nature 419, 912-915(31 October 2002)

doi:10.1038/nature01133

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Figure 1

Engineering stress–strain curves for pure Cu.

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Figure 2

Representative tensile properties of pure Cu.

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Figure 3

Transmission electron micrographs showing the evolution of the Cu microstructure.

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Figure 4

Transmission electron micrographs of Cu after different tensile strains.

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