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Graphene-based integrated photonics for next-generation datacom and telecom

Nature Reviews Materials volume 3, pages 392–414 (2018)Cite this article

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Abstract

Graphene is an ideal material for optoelectronic applications. Its photonic properties give several advantages and complementarities over Si photonics. For example, graphene enables both electro-absorption and electro-refraction modulation with an electro-optical index change exceeding 10−3. It can be used for optical add–drop multiplexing with voltage control, eliminating the current dissipation used for the thermal detuning of microresonators, and for thermoelectric-based ultrafast optical detectors that generate a voltage without transimpedance amplifiers. Here, we present our vision for graphene-based integrated photonics. We review graphene-based transceivers and compare them with existing technologies. Strategies for improving power consumption, manufacturability and wafer-scale integration are addressed. We outline a roadmap of the technological requirements to meet the demands of the datacom and telecom markets. We show that graphene-based integrated photonics could enable ultrahigh spatial bandwidth density, low power consumption for board connectivity and connectivity between data centres, access networks and metropolitan, core, regional and long-haul optical communications.

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Fig. 1: The evolution of communications.
Fig. 2: Optical absorption profiles of SLG devices.
Fig. 3: FOM for electro-refractive modulators and electro-absorption modulators based on SLG.
Fig. 4: Transmission of a reconfigurable optical ADD–DROP multiplexer and effect of τ on its performance.
Fig. 5: Double-gated thermoelectric photodetector.
Fig. 6: Process flow of a SLG photonics integrated device.

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Acknowledgements

This work was conceived within the Graphene Flagship project. The authors acknowledge funding from the European Union H2020 Graphene Project, European Research Council (ERC) Grant Hetero2D and Engineering and Physical Sciences Research Council (EPSRC) grant nos. EP/509 K01711X/1, EP/K017144/1, EP/ N010345/1, EP/M507799/5101 and EP/L016087/1.

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Authors and Affiliations

  1. CNIT, Photonics Networks and Technologies Laboratory, Pisa, Italy

    Marco Romagnoli & Vito Sorianello

  2. CNIT, University of Udine, Udine, Italy

    Michele Midrio

  3. ICFO-Institut de Ciencies Fotoniques, The Barcelona Institute of Science and Technology, Castelldefels, Spain

    Frank H. L. Koppens

  4. ICREA, Institució Catalana de Recerça i Estudis Avancats, Barcelona, Spain

    Frank H. L. Koppens

  5. IMEC, Leuven, Belgium

    Cedric Huyghebaert

  6. Advanced Microelectronic Center Aachen, AMO GmbH, Aachen, Germany

    Daniel Neumaier

  7. Nokia Italia, Vimercate, Italy

    Paola Galli

  8. Nokia Deutschland AG, Bell Laboratories, Stuttgart, Germany

    Wolfgang Templ

  9. Ericsson Research, Pisa, Italy

    Antonio D’Errico

  10. Cambridge Graphene Centre, Cambridge University, Cambridge, UK

    Andrea C. Ferrari

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All authors conceived this work and collaborated equally in the writing of the text.

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CLR4: https://www.clr4-alliance.org/

Ethernet Alliance: http://www.ethernetalliance.org/

Information and Communication Technologies, Environmental Sustainability and Climate Change: http://www.itu.int/en/action/climate/Pages/default.aspx

International Technology Roadmap for Semiconductors 2.0, 2013 Edition, Design: http://www.itrs2.net/2013-itrs.html

International Telecommunications Union: Interfaces for the optical transport network: https://www.itu.int/rec/T-REC-G.709/en

International Telecommunications Union: Support of IP-based services using IP transfer capabilities: https://www.itu.int/rec/T-REC-Y.1241/en

Internet of Everything: https://newsroom.cisco.com/ioe

New 2018 Ethernet roadmap looks to future speeds of 1.6 terabits/s. inside HPC: https://insidehpc.com/2018/03/new-2018-ethernet-roadmap-looks-future-speeds-1-6-terabits-s/

Photonics Component & Circuit Design Software: https://www.lumerical.com/tcad-products/

Si-on-insulator (SOI): https://order.universitywafer.com/default.aspx?cat=Silicon%20on%20Insulator%20(SOI)%20wafers

The ethernet roadmap: https://newsroom.cisco.com/ioe

Xilinx: https://www.xilinx.com/publications/about/3-D_Architectures.pdf

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Romagnoli, M., Sorianello, V., Midrio, M. et al. Graphene-based integrated photonics for next-generation datacom and telecom. Nat Rev Mater 3, 392–414 (2018). https://doi.org/10.1038/s41578-018-0040-9

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