Erratum to: Microsystems & Nanoengineering (2015) 1, 15013; doi: 10.1038/micronano.2015.13; Published online: 20 July 2015
Since the publication of this article, the authors would like to make two corrections in the third(last) paragraph of “Design and Fabrication” section as follows:
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1
Replace “fused deposition modeling technology” with “multi-jet modeling (MJM)”;
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2
The company information of “ProJet HD 3000 printer, Hewlett-Packard Company, Palo Alto, CA, USA” should be replaced with “ProJet HD 3000 printer, 3D Systems Inc., Rock Hill, SC, USA”.
We apologize for any inconvenience may have caused.
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The online version of the original article can be found at 10.1038/micronano.2015.13
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Wu, SY., Yang, C., Hsu, W. et al. Erratum: 3D-printed microelectronics for integrated circuitry and passive wireless sensors. Microsyst Nanoeng 1, 15036 (2015). https://doi.org/10.1038/micronano.2015.36
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DOI: https://doi.org/10.1038/micronano.2015.36
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