Abstract
THE dynamical behaviour of metal particles or films deposited on ceramic surfaces is of great importance in heterogeneous catalysis, metal brazing of ceramics and microelectronics. The existing understanding of, for example, metal particle sintering or dispersion has tended to be based on static, room-temperature ex situ studies, which have considered only surface spreading of the metal1–3. Here we present evidence from in situ electron microscopy for the diffusion of metal particles through the bulk of a ceramic substrate. We have studied the dynamics of small copper particles on the surface of amorphous alumina in various oxidizing and reducing atmospheres (hydrogen, oxygen and carbon monoxide). Under oxygen, particles first diffuse through the substrate with little change in shape, but at later times particles spread laterally (by surface or sub-surface diffusion) to a configuration of lower surface energy. We suggest that these diffusion processes may be important in electronics applications, which involve similar combinations of materials.
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Gal, P., Smith, B. & Owen, G. Bulk diffusion of metal particles on ceramic substrates. Nature 348, 430–432 (1990). https://doi.org/10.1038/348430a0
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DOI: https://doi.org/10.1038/348430a0
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